5月6日消息，据外媒报道，由于智能手机市场对HDI板的强烈需求，台湾印刷电路板供应商包括欣兴、华通电脑和耀华电子等已经在2014年第二季度提高HDI板生产线产能利用率。

此外，在韩国HDI板生产线被烧毁后，台湾PCB制造商在3月份接收到更多订单。欣兴将其HDI板生产线利用率从低于70%提升到80-90％。华通目前HDI板产能利用率超过80％，而联科计划进一步扩大任意层HDI板产能。苹果计划在2014年下半年推出新款iPhone，HDI板供应预计一直到年底都将保持相对紧张。（元器件交易网   白玉涛译）

以下为外文：

Taiwan-based PCB suppliers, including Unimicron Technology, Compeq Manufacturing and Unitech Printed Circuit Board, have ramped up the capacity utilization rates of their HDI board production lines significantly in the second quarter of 2014 due to strong demand from the smartphone sector, according to industry sources.

The recent roll-outs of new models by Samsung Electronics, HTC, Sony Mobile Communications, Asustek Computer as well as by China-based handset vendors have driven up demand for HDI boards, particularly those high-end models, said the sources.

Additionally, Taiwan-based PCB makers have also landed more windfall orders after March when the HDI board production lines of Korea-based DAP were damaged by fire, the sources added.

Unimicron has ramped up the utilization rate of its HDI board production lines to 80-90% recently compared to below 70% earlier in the year, the sources noted.

Compeq is currently operating at over 80% of its production capacity, while Unitech plans to further expand its capacity for any-layer HDI boards, the sources indicated.

With Apple planning to release its new iPhone in the second half of 2014, the supply of HDI boards is expected to remain relatively tight until the end of the year, the sources commented.